Congate, a leading global provider of embedded and edge computing technologies, has announced that its conga-TC570r COM Express Type 6 compact module powered by Intel ® 11th Generation Core ™ (codenamed “Tiger Lake”) processor has received IEC-60068 certification. This certification shows that the modules can be used in the field of railway transport, and also affirms the excellent performance of the series in dealing with extreme conditions such as large temperature differences, rapid temperature changes, large shocks and strong vibration. In addition, the module is attached to all components such as CPU and memory, which can complete various key core tasks, bringing great advantages to customers.

The IEC-60068-certified conga-TC570r module is suitable for a variety of new railway applications, including train control and management systems (TCMS), predictive maintenance, passenger information systems, video surveillance and analytics, ticketing and fare collection, and fleet management and optimization. In addition, the modules can also be used in other harsh application scenarios beyond rail and transportation, including automation, autonomous guided vehicles (AGVs), autonomous driving robots (AMRs), etc., which require advanced embedded computing power provided by Intel’s 11th-generation core processors. This series of modules provides this capability through an industry-standard design that complies with all specifications and requirements of IEC-60068.

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Certification details

The conga-TC570r module has been rigorously tested and certified according to several standards of IEC-60068. The certification shows that the module can operate reliably in the extended temperature range from -40°C to +85°C, and can withstand temperature changes (IEC-60068-2-14 Nb) and rapid temperature changes (IEC-60068-2-14 Na). In addition, the module meets the shock and vibration resistance specified in DIN EN 61373 April 2011 Category 2(Railway applications). According to the IEC-60721-3-7 7K3, 7M2 class, the module can also further meet the operating conditions of high humidity environments, by equipping the module with a triple protection coating to improve the resistance of the module to liquids and moisture.

The ultra-rugged COM Express compact Type 6, equipped with Intel 11th-generation core modules with surface Mount RAM and In-BandECC (IBECC) support, is available In the following configurations or can be customized to your needs:

Congatet also offers appropriate carrier boards and comprehensive cooling solutions for its IEC-60068-certified COM Express modules, allowing customers to quickly roll out application designs. The unique passive heat pipe cooling solution introduced by Congate adopts a fanless design to effectively optimize the heat dissipation and durability of the module, extending the service life and reliability of the module. In addition, Congatet provides design and compliance assessment services for PCIe Gen4/5 and USB4 to simplify and accelerate application design, improve design security, and shorten product time-to-market.