On October 10, 2023, [NXP Innovation Technology Forum] was held in Renaissance Hotel, Shenzhen Bay. Many enterprises from industrial, Internet of Things, new energy and medical industries attended the forum to exchange in-depth market trends and industry insights, and discuss how to jointly face market opportunities and challenges, and jointly promote the development of the future market. As a deep partner of NXP, Mil Electronics was invited to give a speech and exhibit innovative products developed based on NXP MPU chips.

At the forum, Alan, deputy general manager of Mill Electronics, delivered a keynote speech on “Core Board and Solution based on NXP embedded Processor”, mainly introducing Mill’s leading design concept and R&D innovation in embedded MPU modules to bring customers higher performance, smaller size, more stable and reliable, and lower cost modules. To enable customers to quickly develop and market products, the industry application cases of Milky in NXP series products are described.

As a professional company providing embedded MPU modules and solutions, Mir has maintained close cooperation with NXP, and has launched more than 20 core board products based on NXP i.MX6 series, i.MX8 series, LS series, i.MX9 series processors, etc. And widely used in industrial Internet of Things, intelligent control, industrial display, new energy, smart medical, smart transportation and other fields. The MPU module of Mill Electronics is used to solve the challenges of complex embedded systems, realize the leap in product development and delivery, and empower the embedded development industry.

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The Mill is based on the core board of the NXP embedded processor

At this event, Mill Electronics brought its latest products MYC-LMX9X core board and development board – based on NXP i.MX 93/i.MX 91 processors. This core board has 2*Cortex-A55@1.7GHz+Cortex-M33@250MHz, meets the requirements of high performance and real-time, integrates 0.5TOPS special neural processing unit, enabling low-cost lightweight AI applications; And support 2 Gigabit Ethernet interface (1 support TSN), 2 CAN FD interface, 2 USB2.0 interface, 8 UART interface, 8 I2C, 8 SPI, 2 I3C; With a rich display interface LVDS/MIPI DSI/ 24-bit RGB, support 1080p60 display, rich multimedia applications.

Booth on-site – Core boards and development boards from Milky NXP i.MX 93/i.MX 91

MYC-LMX9X core board uses a new LGA package, solid interface to save connector costs, small size, only 37mm*39mm, to meet the charging pile, energy and power, motion controller, industrial display and control integration, medical equipment and other industries.

Mil’s new LGA package of NXP i.MX 93/i.MX 91 based core boards

Milky’s core boards and development boards for NXP i.MX 93/i.MX 91

This activity, Mir and NXP and excellent enterprises in the industry exchange and discuss, so that Mir is more confident in the development of the industry, the future of Mir Electronics will continue to explore and innovate, launch more products, serve industry customers, for customer product intelligent upgrade help, promote the development of the industry.