“Give semiconductor ten years, achieve a trillion-scale market.” According to McKinsey research, the global semiconductor industry will grow rapidly in the next decade and is expected to develop into a trillion-dollar industry by 2030. In the manufacturing workshop of this trillion-level tuyere market, the figure of composite robots began to appear frequently.

How can a composite robot capture Fang Xin?

Semiconductor industry pain points:

VT-VSPA1-1-11 The manual handling path is long, the frequency is high, the efficiency is low and the error rate is high

The goods are highly valuable and easily damaged

Production workshop cleanliness requirements are high, the environment is complex

Traditional industrial robots are difficult to cross the cleanliness threshold

It is difficult to transform old production lines automatically

Production line demand is flexible and changeable

The high standard and flexible operation needs of the semiconductor industry make the composite robot that integrates the functions of “brain, eye, hand and foot” come into being. At present, most of the composite robots in the industry take different robotic arms, AGV, vision, claw, force control and other products for patchwork assembly and secondary development. However, the “accumulated” composite robots often face problems such as difficult system integration, complex operation, difficult deployment, and long landing cycle.

Based on this, the card robot launched the JAKA S³ mobile operation robot (hereinafter VT-VSPA1-1-11 referred to as the “card complex robot”), with system integration, modular hardware design solutions, the existing difficulties are broken one by one, the production line upgrade more flexible (smart), safer (safe), deployment faster (speed). At present, the composite robot has been used in automotive, electronics, precision manufacturing and other fields. As far as the semiconductor industry is concerned, it can be widely used in front-channel wafer material handling, post-channel wafer box transfer, magazine handling, CNC loading and unloading scenarios.

One of the best and one of the best

1, system integration, integrated configuration

The joint-card composite robot adopts an integrated software and hardware solution, with its own master control system and unified human-computer interaction and data interface. Users can uniformly configure the technical parameters of AMR, robot arm and sensing device on the JAKA Zu APP, and one operating terminal can complete the parameter configuration of the composite robot, map scanning creation, route editing, task delivery, etc., which is not bound by the cumbersome operation interface of multiple systems, and debugging and deployment are faster.

2, modular design, scene switch

In the semiconductor industry, the production process is discrete, VT-VSPA1-1-11 the links are complex, and the production line is flexible. In order to enter the industry, the robot must be able to quickly respond to the needs of dynamic changes in the operation scene. The modular hardware design scheme is adopted, and the standard chassis of the composite robot has all the basic functions. Like building blocks, users can flexibly select backpack modules and fixtures required for different processes such as wafer box, magazine handling, etc., to create a highly flexible flexible production line and quickly change production lines

3, strong damping ability, both “stable” and “fast”

Due to the particularity of the semiconductor industry, the price of wafers is relatively expensive, and the high stability of robot operations is particularly important. The joint card composite robot has two functions of “mobile” and “operation”, dual laser and dual vision obstacle avoidance + collision detection and support, and the average speed of the equipment can reach up to 1.5m/s, which can meet the demand of 0.3g vibration quantity, and effectively solve the raw material loss caused by manual instability affecting the comprehensive dynamic rate and excessive vibration value in the current wafer box transfer process. The problem that leads to product obsolescence is both stable and fast.

4, the perception of rising dimension, without fear of interference mission will reach

Self-developed 2.5D vision correction compensation technology, the joint and card composite robot can dynamically estimate the spatial pose. With the support of the visual positioning compensation system and the bias compensation algorithm, the JAKA S³ mobile robot has a very high adaptability to the effects of light changes and debris, and the comprehensive positioning accuracy can reach ±0.5mm, which fully meets the requirements of high-precision docking during the process of taking and placing materials in the wafer box.

5, fast replenishment, 24 hours long-term operation and maintenance

Support manual, automatic, single battery and double battery power replacement four kinds of replenishment, double battery power replacement can be continuous power replacement within 1 minute, fast replenishment, to achieve 24 hours of continuous robot on duty, effectively reduce unit cost, meet the long-term task needs of the factory, improve equipment utilization.