Self-healing: When the material is damaged, its internal chemical bonds are broken, and these dynamic chemical bonds (hydrogen bonds, disulfide bonds, metal coordination bonds, etc.) are reorganized through diffusion, thus realizing self-healing. At present, the research of self-healing materials focuses on the development of polymer materials with ductility and self-healing properties, which have broad application prospects in the field of electronic skin.

KJ3221X1-BA1 3) Biocompatibility and biodegradability: The application scenarios of electronic skin are usually closely related to biological interfaces, and biocompatibility is an important property to avoid triggering immune responses. At present, there have been significant advances in the development of biotolerant and biodegradable devices, making the application of electronic skin more stable.

Machine sensing is an important application of electronic skin in the field of robotics. For example, the design goal of intelligent humanoid robots and prosthetic robots is to achieve accurate humanoid operation and need to achieve high-precision integrated sensing functions. Therefore, the corresponding flexible electronic skin needs to consider the following aspects: (1) real-time detection of multiple mechanical stimuli and haptic feedback; ② Integrated multi-function sensor, can KJ3221X1-BA1 detect temperature, humidity, hardness and other parameters; ③ Wireless signal transmission and control of man-machine interface. Current research directions need to focus on deployable, high-resolution sensor skins, algorithms that can efficiently process dense sensor information, and high-precision feedback control of robots, with the ultimate goal of enabling robots to achieve highly human-like sensing and touch capabilities.

In order to realize or surpass the perception ability of human skin, the current electronic skin has been developed in the direction of multi-mode composite. An intelligent integrated multi-layer nanofiber structure bionic multi-functional flexible sensor can simultaneously detect pressure, humidity and temperature signals. The electronic skin consists of four parts: the first layer is a pressure sensing layer; The second layer is the temperature sensing layer; The third layer is used for humidity detection; The fourth layer uses a triboelectric acquisition system to collect biomechanical energy and provide energy for temperature and humidity sensing. The temperature sensing layer uses multi-wall carbon nanotubes and PEDOT:KJ3221X1-BA1 PSS as conductive materials, and the humidity sensing layer uses acidified carbon nanotubes as conductive materials.

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In addition to conventional pressure/strain and temperature sensing, the existing multi-dimensional electronic skin can also realize the perception of weak gas, pH and glucose stimuli.

The large-scale production of electronic skin still has several technical difficulties that need to be broken through. 1) The manufacturing process needs to be simplified. In order to meet the needs of the bendability and ductility of the electronic skin, the electronic skin circuit mostly adopts a serpentine geometry structure, and uses transfer technology to assemble the circuit on the elastic substrate, the disadvantage is that the process design is cumbersome, and usually requires a special clean room, and the cost is high. Electronic printing technologies (3D printing and inkjet printing, etc.) are expected to simplify the corresponding manufacturing process and have advantages such as low cost KJ3221X1-BA1 and scalable production, but printing on flexible substrates still has technical challenges and needs to be further optimized. 2) Multi-functional detection capability needs to be improved. At present, the application scale of multi-functional electronic skin devices is limited, especially the detection function of integrating physical and chemical signals. In order to achieve a high degree of imitation of biological skin, simultaneous acquisition of various forms of data is very important in advanced electronic skin applications, and can obtain more accurate analysis results based on different forms of information. 3) More intelligent modules need to be integrated. Current e-skins have only rudimentary signal processing capabilities, and often require the help of external devices in the face of big data and complex algorithms. If the sensor can integrate a miniaturized intelligent module with stronger computing power, it is expected to eliminate the dependence on external rigid devices, improve the level of electronic skin flexibility, and achieve high-precision analysis and control. 4) Flexible integrated chips need to be further developed. At the low level of integration, the existing electronic skin needs to rely on rigid integrated chips to achieve complex actions, so flexibility and stretchability are sacrificed, and KJ3221X1-BA1 the rigid and flexible binding parts are greatly different from the Young’s modulus of the material, which will lead to the overall fatigue resistance of the device is reduced, and the working state is unstable. Therefore, the rigid-flexible combination strategy of hybrid electronic skin needs to be optimized, and the development of flexible integrated chip is expected to realize the full flexible electronic skin with multiple functions.