Silicon Labs (NASDAQ), a global leader in building a more connected world with secure, intelligent wireless connectivity technologies: SLAB, Inc. today announced the launch of its new xG26 series of wireless System on Chip (SOCs) and Microcontrollers (MCUS), the highest performance series to date from leading companies in the Internet of Things industry. The new family includes multi-protocol MG26 SoCs, Bluetooth LE BG26 SOCs and PG26 MCUS. All three products have twice the flash and RAM capacity of other multi-protocol products from Chip Technology and are designed to meet the needs of the future Internet of Things (IoT) for some demanding emerging applications such as Matter.

“As users from the consumer to industrial sectors reap more benefits from their iot deployments, their demand is steadily increasing.” Matt Johnson, chief executive officer of Chip Technology. “The new xG26 series is built for the future and gives equipment manufacturers confidence that their current designs will meet the needs of the future.” ”

2711-T10C10 To help designers build devices capable of running advanced iot applications, the xG26 family offers the following features:
• Double the flash, RAM and GPIO capacity compared to the xG24 family, enabling iot device manufacturers to develop advanced edge applications. It has twice as many general purpose input/output (GPIO) pins as the xG24, meaning device manufacturers can connect it to twice as many peripherals for better system integration.
ARM® Cortex-M33 cpus and dedicated cores for RF and security subsystems enable higher performance computing power in a multi-core format, helping to free up the main core for customer applications.
Embedded artificial intelligence/machine learning (AI/ML) hardware acceleration enables machine learning algorithms to process up to 8 times faster while consuming 1/6 of the original power, achieving greater energy efficiency.
• Optimal security through Core Secure Vault™ technology and ARM TrustZone technology. Using our custom component manufacturing services, xG26 products can also be hard-coded during manufacturing using customer-designed security keys and other features, further enhancing their vulnerability resistance.
• 2.4GHz wireless connectivity with Core’s proven, tested and certified 2.4GHz wireless protocol software stack, including Matter, Zigbee, OpenThread, Bluetooth Low Energy, Bluetooth Mesh networking, proprietary protocols and multi-protocols, while providing the best RF link budget to increase transmission range, Reduce transmission retries for a better user experience and longer battery life.

The MG26 multi-protocol SoC is designed to be the most advanced SoC that supports Matter over Thread

2711-T10C10

Core is focused on Matter, a rapidly deployable application-layer protocol that enables devices to interoperate across leading iot networks and ecosystems. Chip Technology is the largest contributor of Matter code in the semiconductor sector and the third largest contributor of code among all vendors. The experience gained from working on the development of Matter has given Chipcore a deep understanding of how to build products that are compatible with the evolving needs of Matter standards as Matter adds support for new device types and security enhancements. In the 18 months to date since the release of Matter 1.0 in October 2022, demand for Matter code has grown by 6% across most device types.

Consumers who invest in building matter-enabled smart homes won’t want their new devices to become obsolete in a few years. Instead, they want to be confident that the Matter device they bought last year will still work with the same device and be as secure as the next Matter device they buy next year. This is Matter’s promise of interoperability and security, and why Chip has designed the MG26 to be the most advanced SoC to support the Matter standard.

2711-T10C10 Built on the same platform as the award-winning MG24 multi-protocol wireless SoC, the MG26 has twice the flash and RAM capacity of the MG24 and can be configured with up to 3,200 KB of flash and 512 KB of RAM. The MG26 also has twice as many GPIO pins as the MG24, which means device manufacturers can connect it to twice as many peripherals for better system integration.

MG26, BG26, and PG26 integrate Core’s proprietary matrix vector AI/ML hardware accelerators to enable higher intelligence not just for Matter applications, but for all applications. The dedicated core is optimized for machine learning, processing machine learning operations up to 8 times faster while consuming 1/6 of the power of traditional embedded cpus. This significantly improves the energy efficiency of the series, as these products can share machine learning-based activation or wake-up cues with the accelerator, allowing more power-hungry functions to go to sleep, which can minimize battery consumption. This is ideal for battery-powered smart home devices such as sensors or switches, as consumers want these devices to be hidden in their home environment, rather than needing to constantly change batteries to get their attention.

Chip strengthens its leadership position in the Internet of Things industry with a new family of SoCs and MCUS

Core Technology is one of the world’s leading companies fully focused on the Internet of Things, and its breadth, depth and expertise in the Internet of Things is unmatched by other companies. That’s why the xG26 is being launched as a family of products. The MG26 is ideal for Matter, the BG26 Bluetooth SoC has all the same features and is optimized for Bluetooth Low Energy and Bluetooth mesh networks, while the PG26 provides low-power intelligence for non-connected applications such as closed-circuit surveillance (CCTV) cameras, remote controls and children’s toys. The pin-compatibility between more advanced xG26 and xG24 products, as well as shared hardware and software development tools such as Simplicity Studio, make development simple and support seamless migration from other products of the second generation wireless development platform.