0010-22985 E-CHUCK heater

Product model and identification: The product model is “AMAT 0010-22985” and the name is E-CHUCK heater.
Uses and features: E-CHUCK heaters are mainly used in semiconductor processing equipment, especially those related to wafer processing. As a type of ceramic heater, it has a uniform temperature distribution and is able to heat the wafer evenly, ensuring a high-precision reaction on the substrate surface and the formation of a film.
Materials and properties: Aluminum nitride ceramic materials may be used, which have electrical insulation and excellent thermal conductivity and are ideal for applications requiring heat dissipation. Aluminum nitride has a thermal expansion coefficient close to silicon and excellent plasma resistance, which makes it ideal for manufacturing semiconductor processing equipment components.

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Description

Overview


Essential details:0010-22985 E-CHUCK heater

Product Description

Product model and identification: The product model is “AMAT 0010-22985” and the name is E-CHUCK heater.
Uses and features: E-CHUCK heaters are mainly used in semiconductor processing equipment, especially those related to wafer processing. As a type of ceramic heater, it has a uniform temperature distribution and is able to heat the wafer evenly, ensuring a high-precision reaction on the substrate surface and the formation of a film.
Materials and properties: Aluminum nitride ceramic materials may be used, which have electrical insulation and excellent thermal conductivity and are ideal for applications requiring heat dissipation. Aluminum nitride has a thermal expansion coefficient close to silicon and excellent plasma resistance, which makes it ideal for manufacturing semiconductor processing equipment components.
Applications: High temperature base components are widely used in a variety of equipment requiring a high temperature environment, such as semiconductor processing equipment, PCR instruments, and industrial heating equipment for heating workpieces at high temperatures.
Performance characteristics: High temperature base components usually have high temperature resistance, good thermal stability, good insulation performance and corrosion resistance

0010-22985

Product parameter

Temperature resistance: able to work stably at extreme high temperatures, which may exceed 1000 ° C.
Thermal stability: Stable temperature distribution and mechanical properties at high temperatures.
Insulation performance: effectively isolate high temperature area and low temperature area to prevent heat transfer to the surrounding environment.
Corrosion resistance: It can resist various corrosive media in high temperature environment.

APPLICATION

High temperature base components, such as Model “0010-22985”, are designed for stable operation in extremely high temperature environments and have been used in a number of specialized fields:
Semiconductor processing equipment: Components are used to support and heat 300mm diameter semiconductor wafers or other material substrates to achieve specific process processes such as heat treatment, annealing, oxidation, diffusion, etc., in high temperature environments.
PCR instrument: As part of the temperature control package, it is used to precisely control the temperature during the polymerase chain reaction (PCR) process.
Industrial heating equipment: including electric furnaces, heat treatment furnaces, etc., where components are used to heat workpieces at high temperatures.
Underground oil and gas industry: In these applications, high-temperature electronics need to operate at harsh underground well temperatures in excess of 200°C and withstand pressures in excess of 25 kpsi.
Avionics: With the trend towards “multi-electronic aircraft “(MEA), high-temperature electronics are used in distributed control systems to replace traditional centralized engine controllers, which can increase ambient temperatures to +200°C.
Automotive: As the automotive industry shifts from purely mechanical and hydraulic systems to mechatronics, high-temperature electronics are used for positioning sensors closer to heat sources, signal conditioning, and control electronics

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