Since the release of the core board of the T113 series, this cost-effective, low-cost, entry-level, high-performance domestic core board has been consulted continuously, and the supporting development board has been traded hundreds of sets, which is favored by engineers. In order to collect the full series of products of T113, the core board and development board based on the T113-I processor have been released by the Mill. So that the majority of engineers have more choices. Next, look at the performance and advantages of the T113-i domestic core board.

MYC-YT113i domestic core board

Real domestic core board, 100% domestic material certification

The core board is made of 100% domestic materials, certified by the authority of Saibao Laboratory, the materials are controllable, the product life cycle is long, the localization is fully verified, and the end user can be assured to choose.

Figure: MYC-YT113i domestic core board – Material self-controlled certification report

Full Chi T113-i processor, cost-effective

T113-i is a cost-effective, entry-level embedded processor for intelligent industrial control and automotive applications. The T113-i processor is equipped with 2*Cortex-A7@1.2GHz, external DDR2/DDR3 ports, 1080p HD video decoding, and HiFi4 DSP. in addition, it also has video capture interface (Parallel-CSI/CVBS in), display interface (MIPI-DSI/LVDS/RGB/CVBS out), USB2.0 interface, CAN interface, Gigabit Ethernet interface, This makes it particularly suitable for applications such as entry-level industrial human-machine interfaces (HMI) and embedded devices with video capabilities.

External DDR3 for flexible capacity configuration

To meet the needs of different industries, the Mir T113-i core board DDR3 memory is available in a flexible configuration: 256MB/512MB/1GB. For different industry needs, users can freely choose the most suitable core board model according to their actual needs.

Gold sinking technology, reliable quality

The MYC-YT113i core board adopts high density and high speed circuit board design, and integrates T113-i, DDR3, eMMC, E2PROM, discrete power supply and other circuits on the 37mm*39mm board. The core board is welded to the bottom plate in the form of SMD patches, and the pins are stamp holes +LGA packages. The board adopts 6 layers of high density PCB design, gold sinking process production, independent grounding signal layer, lead free.

 

Rich peripheral resources

MYC-YT113i core board through the stamp hole +LGA lead signal and power ground a total of 140+50 pins, these signal pins contain a wealth of peripheral resources.