For engineers, choosing a suitable processor for development is a particularly important step, and how to choose a suitable for their own design and development of the core board, today we are to ST company’s MP1 series processors for analysis and comparison.

ST has released two different types of MPU chips, the STM32MP15 series and the STM32MP13 series, and the characteristics of these two chips are also very distinct. STM32MP15 uses ARM A7 + M4 heterogeneous CPU, can achieve dual system support Linux and real-time applications, and has 3D GPU and MIPI display interface; The STM32MP13 series is streamlined compared with the 15 series, the processor frequency is increased to 1GHz, dual Gigabit Ethernet, dual CAN FD is very suitable for industrial Internet of things and automotive communication fields; And very cost-effective price and low power mode.

As ST’s annual official partner, Mil Electronics has followed ST’s footsteps since 2019 by simultaneously releasing STM32MP151,157 and the STM32MP135 series core board and development board launched this year. Mill uses a high-performance stamp hole design, compact size and reliable connection, built-in power management, DDR, EMMC/NAND FLASH chip, so that customers can skip complex power supply design, and exclusive metal shielding for dust and touch resistance, and can also be carved according to customer needs.

And how to choose the right core board for design? We can compare by the following points.

1. Different processor performance

The MYC-YA15XC-T core board is based on the STM32MP151 processor, which is a single Cortex-A7+ single Cortex-M4 heterogeneous architecture.

The MYC-YA157C core board is based on the STM32MP157 processor, which is a dual-core Cortex-A7+ single Cortex-M4 heterogeneous structure, and also integrates the GPU, MIPI DSI, CAN FD and other control units.

MYC-YF13X core board is based on the STM32MP135 processor, this CPU is a single-core Cortex-A7 processor with a maximum frequency of 1GHZ, and the internal integration of dual-channel Gigabit Ethernet, two-channel CAN FD and other control units.

2. Different modules

The MYC-YA157C has one more gigabit network PHY chip than the MYC-YA15XC-T, which uses ST’s power management chip, STPMIC1.

3. Different sizes

The sizes of the three modules are different, MYC-YF13X and MYC-YA15XC-T are 39*37mm, MYC-YA157C core board is 43*45mm,

4, the connection PIN is different

The pin number of the three modules is different, MYC-YF13X and MYC-YA15XC-T are 148PIN stamp holes, and MYC-YA157C core board is 164PIN stamp holes.