A semiconductor high-tech enterprise is striving to complete the independent control of semiconductor bonding key technologies, get rid of the long-term import monopoly of semiconductor sealing and testing links, and contribute to the localization of semiconductor key sealing and testing equipment.

Project challenge

S21260-SRS Bonding machine is a device used for semiconductor packaging, which is mainly used to bond the chip with the substrate or lead frame to realize the connection between the chip and the circuit board. The equipment is mainly composed of bonding head, control system, drive system, heating system, cooling system and so on. In the bonding process, the bonding head compacts the chip with the substrate or lead frame, and forms a metal bond between the chip and the substrate or lead frame by heating, pressurizing, etc., so as to realize the connection between the chip and the circuit board.

In the process of continuously improving the technological level of bonding machine equipment, the application of electrical automation of equipment has become a key. Therefore, as an important component and control center of bonding equipment, electrical control is the core component to ensure stable, reliable and efficient operation of equipment. In order to achieve this goal, the company first needed to select the right switch power supply product for the control cabinet, and its key considerations included:
• Power supply volume

S21260-SRS The design space in the electrical cabinet is limited, and more electrical products need to be installed, leaving less space in the cabinet for the power supply. Therefore, a compact design switching power supply with lower power is needed.
• Voltage and current stability

Switch cabinet power supply needs to always keep the output voltage, current, frequency and other parameters in line with the requirements of the bonding machine equipment to ensure the normal operation of the equipment, and voltage fluctuations and current instability may lead to equipment failure or welding quality decline.

• Heat resistance of power supply

S21260-SRS Taking into account the size of the electrical cabinet, the density of electrical components and heating, ambient temperature and ventilation conditions and other factors, the temperature environment of the bonding electrical cabinet is high, and the switching power supply is required to cope with the harsher operating environment.

solution

The Weidmuller PROmax series of single-phase switching power supplies provides specialized solutions for precise automation applications such as semiconductors.• The compact design of the PROmax series single-phase switching power supply, with a minimum power of 70W and a width of only 32mm, is ideal for the narrow bonding cabinet space.
• The PROmax series single-phase switching power supply modules are designed for excellent performance and durability, reliably coping with up to 20% continuous overload or 300% peak load, always maintaining a stable output, achieving high boost capacity and full power.
•PROmax series single-phase switching power supply can operate safely in the high temperature environment of the electric cabinet, even up to 60 °C environment, and can also start at -40 °C environment.

Customer benefits

With the introduction of Weidmuller PROmax series single-phase switching power supply, the company has solved the worries of electrical control power supply for semiconductor bonding equipment and achieved:
• Greatly saves cabinet space

The switching power module that meets the specifications and dimensions of the electric cabinet helps the power supply space in the customer’s cabinet to be reduced by about 30%.
• Reliable and stable operation

Consistent and stable voltage, current and power output ensure the stable operation of the components in the entire electrical cabinet, so as to achieve the automatic control requirements of the welding process of the bonding machine.
• Meet the harsh working environment of electric cabinet

Reliable power supply in the high temperature working environment of the electric cabinet, eliminating the concerns of components heating, ventilation and other constraints.

Final effect

On the road of semiconductor equipment localization, the sealing and testing equipment represented by the bonding machine needs to improve the technical level. In terms of meeting the electrical automation requirements of bonding equipment, Weidmuller, with its deep experience in the field of electrical connection and leading industrial switching power supply solutions, has well met the requirements of domestic semiconductor sealing and testing equipment manufacturers for high-performance, highly reliable and small-size electrical cabinets, and has brought a series of innovative values to semiconductor sealing and testing equipment manufacturers.