On March 21, Congatet, a leading provider of embedded and edge computing technologies, continued to expand its modular edge server ecosystem. New products include Server carrier boards in the µATX specification and COM-HPC Server modules based on the latest generation of Intel Xeon Ice Lake D processors. The new µATX server board for COM-HPC modules is designed for edge applications and compact real-time servers for critical infrastructure. The µATX Server board is flexible and compatible with Congatet’s latest COM-HPC Server module. Combined with modules powered by the latest Intel Xeon D-1800 and D-2800 processors, customers have immediate access to the µATX platform for applications requiring space-saving, rugged design and high performance.

MMS6110 With the introduction of the new µATX carrier for COM-HPC Server modules, Congatet is fulfilling its commitment as a supplier of ready-to-use advanced computing solutions for the industrial sector. The ecosystem of COM-HPC modules and µATX boards provides original equipment manufacturers (Oems) with a wide range of customization options at the module, board, and system level, with developers free to choose according to their needs. Tailored to the rigors of edge computing, the ecosystem solution provides a robust, reliable, and ready-to-use building block for industrial environments. The modular approach not only reduces time-to-market for new designs, but also ensures their future scalability.

The new conga-HPC/uATX server carrier in the µATX specification – offers a wealth of I/O interfaces and expansion options in a compact standard specification. This makes the carrier an ideal solution for numerous applications, such as virtual machine (VM) consolidation servers or integrated edge servers for energy microgrids, video processing, facial recognition, security applications, smart city infrastructure, and many others. The conga-HPC/uATX server board offers a variety of features to MMS6110 meet such application requirements, including powerful communication capabilities and bandwidth up to 100 GbE, through GPGpus or other compute accelerators, and through a wide range of capabilities. Handles x8 and x16 PCIe extensions for AI-intensive workloads, 2 M.2 Key M slots for NVMe SSDS, and 1 M.2 Key B slot for compact AI accelerators or Wi-Fi/LTE/5G communication modules.

MMS6110

The new conga-HPC/sILL and conga-HPC/sILH Server modules are powered by the new Intel Ice Lake D-1800 LCC and D-2800 HCC processor families. Compared to the previous generation D-1700/D-2700 series, the new processor delivers up to 15 percent better performance for the same thermal design power (TDP). These new COM-HPC modules have improved performance per watt, making them ideal for high-performance applications where cooling budgets were previously limited. In addition, thanks to Intel Speed Select technology, it is easier for designers to balance computing performance and TDP in system design. The latest processors support up to 22 cores with higher clock speeds to support the next generation of edge applications with higher performance per watt for a more energy efficient and reliable design. Scalable edge computing performance and modular approach not only increase design flexibility and future scalability, but also reduce total cost of ownership and shorten time-to-market.

What is impressive about this new COM-HPC Server module is its firmware integrated virtual Machine Manager (Hypervisor), which makes it easier to evaluate consolidated servers for virtual machines. In addition, TCC, TCN, and optional SyncE support provide comprehensive real-time capabilities. This is especially ideal for all networked 5G solutions that require ultra-low latency and strict frequency/clock synchronization.

In addition to the COM-HPC Sever module based on the MMS6110 µATX solution platform, Congate offers a comprehensive range of heat dissipation solutions, including passive heat dissipation solutions for small chassis. In addition to custom conga-HPC/uATX server boards, the service package includes custom BIOS/UEFI and real-time hypervisor implementations, as well as expanded additional Industrial Internet of Things (IIoT) capabilities for digital purposes.