Germany’s Congatet, a leading provider of embedded and edge computing technologies, responds to its recently launched aReady. Strategy to launch the first board level product. Designed for space-constrained robust, high-performance secure Industrial Internet of Things (IIoT) applications, the new 3.5-inch conga-HPC/3.5-Mini carrier is based on the COM-HPC Mini module and supports an extended temperature range of -40 ° C to +85 ° C for immediate deployment to industrial applications. When used with the aReady.COM version of the conga-aCOM/mRLP COM-HPC Mini module, the Hypervisor is pre-installed and the operating system is configured. A software extension pack for secure IIoT connectivity that enables developers to launch product packs and install their applications immediately. It minimizes the difficulty of integration below the application layer and is aimed at embedded and edge computing systems with a wide range of IIoT capabilities, so the solution is also ideal for system integrators.

MVME712A/AM The new Commercial off-the-shelf (COTS) carrier is available in two purchase options. A pure application carrier that supports conga-HPC/mRLP COM-HPC Mini modules, it is the ideal platform for a series of products starting from small series production. For application-specific designs, the complete aReady. Solution offers a high degree of convenience and design security. For example, optional configurations include pre-installed Bosch Rexroth ctrlX OS as well as virtual machines for real-time control, human-machine interface, artificial intelligence, IIoT data exchange, firewall and maintenance/management functions. Both purchase options are available to original equipment manufacturers (Oems) developing sustainable system designs based on off-the-shelf components. Modular COTS configurations are targeted at Oems, system integrators, and value-added resellers (vars) of small industrial product families. The sustainability of this solution is that when performance and functional requirements change, only modules can be replaced, rather than the entire embedded hardware.

MVME712A/AM

Spearheaded by a 3.5-inch application-specific modular embedded computing platform, these two options provide an excellent technical foundation for rapid prototyping and cost-effective balance through processor selection. Custom carrier boards enable Oems to implement dedicated designs with minimal development effort. Processor and performance upgrades can be made with switch modules, reducing costs, shortening time to market, and ensuring a long-term investment in custom carrier designs. By combining modules and carrier boards, larger scale production can also be achieved cost-effectively.

Jurgen Jungbauer, Senior product Line Manager at Congatet Germany, explains: “We wanted to minimize the integration effort in order to provide a great added value to our customers. From our core computer module business perspective, COTS carrier boards and aReady. Policies come pre-installed with hypervisors (hypervisors), operating systems, and IIoT software configurations, and are important additional benefits MVME712A/AM that our modules can now offer our customers. Minimize the workload of Oems by customizing solutions with our embedded design services.”

Detailed functional features

The 3.5-inch conga-HPC/3.5-Mini carrier board is designed for COM-HPC Mini modules, which are available in seven different models, all equipped with 13th-generation Intel Core processors:

As A versatile high-performance carrier for harsh environments, the conga-HPC/3.5-Mini supports a variety of interfaces including 2x RJ45 Ethernet, 4x USB type A, 1x USB type C, DP++ and 4-pin audio external connection options. Three M.2 slots can be used to connect necessary expansion cards, such as integrated AI accelerators, WiFi, Bluetooth and mobile connectivity, and fast NVMe storage. Internal interfaces include USB2, SATA III, HDA and Sound Wire, as well as 2x UART, CAN, GP SPI, eSPI, 12x GPIO and 2x I2C.