Loc Duc Truong, divisional Vice President of Ametek, said: “We are pioneering CMOS image sensor technology, driving innovation in industries ranging from automotive to cinematography. Validation of high-resolution, high-frame rate sensors is challenging due to the sheer size of the extracted layout, resulting in a bottleneck in simulation run time. Siemens’ Solido Simulation Suite provides us with SPICE and FastSPICE toolsets that help us accelerate simulation and memory design by up to 19 times, significantly speeding up validation while providing customers with more innovative design solutions. This has helped us expand our business.”
PXIe-5160 Stephen Fairbanks, CEO of Certus Semiconductor, said: “We are committed to creating a flexible, versatile foundation I/O that allows modern chips to seamlessly adapt to different markets, interfaces, voltages and standards using a single I/O design. Our customers in automotive, industrial, AI, consumer electronics, data center and networking applications are constantly asking for new design requirements, from mature process technologies to advanced process technologies. We are excited to help our customers create I/O libraries to differentiate their products and give them a market advantage over the competition with superior ESD performance. After various evaluations of industrial simulators, we finally selected Siemens Solido Simulation Suite. It can stably achieve up to 30 times the speed improvement and provide good accuracy, which greatly reduces the simulation cycle. “Through this collaboration, we are able to successfully implement chip-proof designs for high-voltage RF applications and deliver reliable multi-protocol I/O solutions that demonstrate adaptability and efficacy in advanced process nodes.”
“Mixel is focused on developing low-power, high-bandwidth MIPI PHY IP solutions for efficient and reliable data communication for a variety of application scenarios, including mission-critical automotive SOCs. Our complex designs require high-volume, high-volume validation to meet stringent specifications, “said Michael Nagib, AMS Director at Mixel.” Using Siemens’ SPICE and mixed-signal validation technology, we have consistently achieved first-shot success. The newly released Solido Simulation Suite increases validation efficiency by three times while maintaining the same accuracy, allowing us to innovate efficiently and expand our portfolio faster.”
PXIe-5160 Randy Caplan, CEO and co-founder of Silicon Creations, said: “As a supplier of chip IP for high performance clocks and low power/high speed data interfaces, our products play a vital role in modern SoCs. The chip design complexity of 5nm and below processes, coupled with the large number of devices, leads to a very slow simulation speed after wiring, which poses a serious challenge to us. Meeting the demanding requirements and tight schedules of end customers requires fast and accurate simulations for designs based on GAA and FinFET process technologies. We were involved in an early use program for Solido Simulation Suite, and using various post-wiring designs, we found that it increased speed by up to 11 times while still maintaining SPICE level accuracy. We look forward to Solido Simulation Suite helping us quickly validate complex designs to ensure first shot success and achieve our high yield goals.”