Description
Overview
Essential details:1C31194G03 High performance and low power consumption
Product Description
High performance and low power consumption: Based on the Intel H110 chipset, the third-generation ice wing embedded quasi-system has high performance and low power consumption characteristics, and can handle a large number of temperature control and equipment monitoring data.
Cooling design: Emerson’s new fanless wide temperature cooling ice wing structure ensures stable operation in a variety of environments.
Network expansion: Support WiFi and 3G network expansion, to meet the communication requirements between the cold chain car and the background management center.
Rich I/O interface: Facilitate the multi-screen display and multi-information sharing of the cold chain transport control management system.
Seismic design: The use of three-dimensional hard disk shock absorption and reliability design, adapt to a variety of harsh working environment.
Modular structure: All aluminum chassis, compact structure, flexible installation, easy to maintain and expand.
Technical specification
Communication protocol: MODBUS RTU protocol is adopted to achieve unified docking with industrial field data acquisition.
Power distribution Unit (PDU) : Modular structure, multi-functional integration, to ensure the power supply of network products safe, stable, reliable.
Monitoring function: With a variety of electrical parameters and environmental parameters monitoring function, to achieve the precise management of the end distribution.
Product parameter
APPLICATION
Superiority products 1C31194G03 High performance and low power consumption
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