Description
Overview
Essential details:810-014025-004 LAM PLCs/Machine Control
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810-014025-004 LAM PLCs/Machine Control
A printed circuit board, a power module and a manufacturing method of the power module are provided, which solves the technical problem of low power density of the existing power module. To achieve the above purpose, the embodiments of the invention adopt the following technical scheme: the printed circuit board of the power module comprises a plurality of conductive layers, an insulating layer separating the conductive layer, and at least one magnetic core groove is provided, the conductive layer forms a conductive winding around the magnetic core groove, and the side wall of each magnetic core groove is provided with at least a half-open depth control groove. The inner wall of the controlled deep groove is a metal wall, and each metal wall forms an electrical connection with at least two layers of the conductive layer, so that the conductive windings of different conductive layers in the at least two layers are connected in series or in parallel. The power module comprises a magnetic core, a semiconductor conversion unit and a printed circuit board; The printed circuit board comprises a plurality of conductive layers, an insulating layer separating the conductive layer, and is provided with at least one magnetic core groove, the conductive layer forms a conductive winding around the magnetic core groove; The magnetic core is installed in the magnetic core slot of the printed circuit board, the semiconductor conversion unit is connected with the printed circuit board, and the magnetic core and the conductive winding to achieve electric energy conversion; At least a semi-open deep control groove is arranged on the side wall of each magnetic core groove, the inner wall of the deep control groove is a metal wall, and each metal wall forms an electrical connection with at least two layers of the conductive layer, so that the conductive windings of the different conductive layers in the at least two layers are connected in series or in parallel. The manufacturing method of the printed circuit board comprises a printed circuit board forming an interphase structure of a conductive layer and an insulating layer;