PPC905AE101 3BHE014070R0101 Circuit board module ABB

PPC905AE101 3BHE014070R0101

Both caulk pads and potting adhesives provide effective thermal management. Although caulk pads have a longer history, recent advances in potting adhesives have in some cases outpaced the performance of caulk pads. Next, let’s compare the two materials in depth.

The first is filling power. Both materials can be form-fitting to a certain extent, but the maximum configurability of gap pads is less than that of potting adhesives due to their solid structure.

Then there’s precision and shape. The advantage of padding pads is that they can be cut into the exact shape of the customer’s parts, but in complex scenarios, such as many devices and complex lines, padding pads can only cover the surface, and the gaps inside the devices need to be filled with other padding materials.

The potting glue is filled and shaped by pouring and daubing. In the process, the polymer is closely connected together to form a good adhesive, which will not be easily pulled apart by external force. Thus, the shape of the potting glue is essentially a compressed shape that helps to determine and control the ease of application and any resulting diffusion.

Now look at the cost side. From the perspective of application scenarios, potting adhesives are universal, and filling pads are more to be customized in bulk, so the automation of potting adhesives is a significant advantage. In contrast, the filler pad is placed in a position where the operator needs to know its orientation. There are top and bottom sides and, in many cases, left and right and up and down directions. Manual pad applications pose a greater risk of human error. Therefore, in the case of rising labor costs, the cost advantage of potting glue will become more and more obvious.